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Liquid-Cooled Cold Plates for Power Semiconductors and Other Applications

Catalog cold plate for power
modules – all copper design
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Custom cold plate for 3500W
power module – 5000 NanoPin™
pin fins inside
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Cold plates for power modules
– copper / plastic design
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Space-saving double-sided
cold plates (power modules on
each side)
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Cold plates for large arrays
of power modules
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- Power semiconductors, such as insulated gate bipolar transistors (IGBTs) or metal oxide-
semiconductor field-effect transistors (MOSFETs), switch electrical to
mechanical power, or electrical to electrical power. The applications for power
semiconductors are widespread and include hybrid electric vehicles, power supplies,
windmills, elevators/escalators, electric motors and induction heating to name a few.
- With increasing performance, power semiconductor modules have begun to generate
enormous amounts of heat. For instance, a single IGBT module can produce 3000W
or more. As heat and power density (the amount of heat per unit area) increase, so
does the need for liquid cooling.
- Amulaire improves on the liquid-cooled cold plates used in power electronics systems by creating cold plates with denser, more complex fin patterns by applying our NanoPin™ technology - thus boosting thermal performance (by increasing surface area) and reducing the device size.
- We typically manufacture cold plates in copper rather than aluminum, to take
advantage of copper's higher thermal conductivity. We also offer cold plates made
with a copper base containing the NanoPin™ and a plastic cover - to reduce the
weight and cost of the cold plate.
- Because our processes often require no machining, parts can be produced in high
volume with low costs. Furthermore, our low-pressure-drop cold plates often mean
less complex manifolds, and lower power pumps can be used in the system design –
providing further cost savings for our customers.
- Amulaire offers standard, catalog cold plates as well as custom designed cold plates
to meet customers’ specific requirements.
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Base Plates for Power Semiconductor Modules

Base plate with integral fin array is
part of a cold plate cooling solution
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- Base plates form the bottom structure of power semiconductor modules and are an
integral part of the heat path. Amulaire can produce base plates with high pin fin
density (NanoPin™) to increase the surface area of the base plate and hence improve
thermal performance. These power semiconductor modules with Amulaire base
plates can then become assembled into a highly efficient liquid-cooled system.
- We can manufacture cold plates in copper rather than aluminum silicon carbide
(AlSiC), to take advantage of copper’s higher thermal conductivity and lower cost.
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Liquid-Cooled Cold Plates for Desktop PCs and Servers

Desktop PC CPU cold plate
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NanoPin™ array in a server cold plate
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- Amulaire supplies cold plates for high-performance, high-power desktop PCs and
servers that increase thermal performance through complex shapes while lowering the
price of the liquid cooling system through high-volume manufacturing processes.
- We offer the highest density of pin fin arrays available based on our NanoPin™
technology – maximizing surface area and therefore thermal performance while
keeping pressure drop to a minimum.
- We can create copper cold plates with intricate fin designs, including multiple fin
directions, and manufacture them cost effectively in high volume, in contrast with
machined parts.
- We can also manufacture cold plates with micro channels – with fins as small as
0.3mm wide and with 0.3mm spacing – for very precise liquid cooling solutions.
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Heat Sinks and Heat Spreaders for High-Brightness LEDs
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Heat sink for MR16 LED
lamp
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- High-brightness LEDs, like semiconductor chips, are getting hotter and hotter.
- Often, LED heat sinks are machined or cast from aluminum. Amulaire can create the
whole LED package in copper, without machining, with fewer thermal interfaces and
better thermal performance, efficiently and cost-effectively.
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Transistor Outline Headers for Laser Diodes
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Transistor Outline Laser
Diode Header
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- Laser diodes are getting hotter – and smaller and more complex. Laser diodes are
very thermally sensitive, meaning if heat can be pulled out, they perform better and
last longer.
- Amulaire can make tiny, intricate copper transistor outline laser diode headers in
mass volume, yielding products that dissipate heat more effectively and that can be
manufactured cost-effectively.
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