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Liquid-Cooled Cold Plates for Power Semiconductors and Other Applications


Catalog cold plate for power modules – all copper design

Custom cold plate for 3500W power module – 5000 NanoPin pin fins inside

Cold plates for power modules – copper / plastic design

Space-saving double-sided cold plates (power modules on each side)

Cold plates for large arrays of power modules
 

  • Power semiconductors, such as insulated gate bipolar transistors (IGBTs) or metal oxide- semiconductor field-effect transistors (MOSFETs), switch electrical to mechanical power, or electrical to electrical power. The applications for power semiconductors are widespread and include hybrid electric vehicles, power supplies, windmills, elevators/escalators, electric motors and induction heating to name a few.
  • With increasing performance, power semiconductor modules have begun to generate enormous amounts of heat. For instance, a single IGBT module can produce 3000W or more. As heat and power density (the amount of heat per unit area) increase, so does the need for liquid cooling.
  • Amulaire improves on the liquid-cooled cold plates used in power electronics systems by creating cold plates with denser, more complex fin patterns by applying our NanoPin technology - thus boosting thermal performance (by increasing surface area) and reducing the device size.
  • We typically manufacture cold plates in copper rather than aluminum, to take advantage of copper's higher thermal conductivity. We also offer cold plates made with a copper base containing the NanoPin and a plastic cover - to reduce the weight and cost of the cold plate.
  • Because our processes often require no machining, parts can be produced in high volume with low costs. Furthermore, our low-pressure-drop cold plates often mean less complex manifolds, and lower power pumps can be used in the system design – providing further cost savings for our customers.
  • Amulaire offers standard, catalog cold plates as well as custom designed cold plates to meet customers’ specific requirements.

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Base Plates for Power Semiconductor Modules


Base plate with integral fin array is part of a cold plate cooling solution
  • Base plates form the bottom structure of power semiconductor modules and are an integral part of the heat path. Amulaire can produce base plates with high pin fin density (NanoPin) to increase the surface area of the base plate and hence improve thermal performance. These power semiconductor modules with Amulaire base plates can then become assembled into a highly efficient liquid-cooled system.
  • We can manufacture cold plates in copper rather than aluminum silicon carbide (AlSiC), to take advantage of copper’s higher thermal conductivity and lower cost.

Liquid-Cooled Cold Plates for Desktop PCs and Servers


Desktop PC CPU cold plate

NanoPin array in a server cold plate

  • Amulaire supplies cold plates for high-performance, high-power desktop PCs and servers that increase thermal performance through complex shapes while lowering the price of the liquid cooling system through high-volume manufacturing processes.
  • We offer the highest density of pin fin arrays available based on our NanoPin technology – maximizing surface area and therefore thermal performance while keeping pressure drop to a minimum.
  • We can create copper cold plates with intricate fin designs, including multiple fin directions, and manufacture them cost effectively in high volume, in contrast with machined parts.
  • We can also manufacture cold plates with micro channels – with fins as small as 0.3mm wide and with 0.3mm spacing – for very precise liquid cooling solutions.
     
 

Air-Cooled Heat Sinks


Complex fin heat sink for industrial PC

BTX format heat sink for desktop PC CPU, with mixed Cu and Al fins

Air-cooled heat sink with heat pipes for high power (1000W) motor drive

FB-DIMM memory card heat sink

  • Amulaire designs and manufactures heat sinks for air-cooled systems such as desktop and laptop computers, servers, industrial equipment, FB-DIMM and other memory cards, graphics cards, and other high-power applications. We can create fully custom heat sinks that fit into essentially any space and for any wattage level.
  • We can create heat sinks with copper or aluminum bases and fins and fins of different thicknesses – and with or without heat pipes.
  • We can create different base shapes to work around components on the board.
  • We offer various methods for attaching the fins to the heat-sink base, including soldering and our own internally developed process that requires no soldering. All our heat sinks are ROHS (Restriction-of- Hazardous-Substances) compliant.
  • Examples of custom heat sinks we have made:
    • Single-piece, fully molded server heat sink with integrated fins
    • Laptop heat sink consisting of a nickel-plated copper insert surrounded by a diecast aluminum housing; the chip attaches to a flat, raised surface on the base that is created without secondary machining
    • Heat sink for industrial PCs with unique curves that naturally and optimally route air flow

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Heat Sinks and Heat Spreaders for High-Brightness LEDs




Heat sink for MR16 LED lamp

  • High-brightness LEDs, like semiconductor chips, are getting hotter and hotter.
  • Often, LED heat sinks are machined or cast from aluminum. Amulaire can create the whole LED package in copper, without machining, with fewer thermal interfaces and better thermal performance, efficiently and cost-effectively.

Transistor Outline Headers for Laser Diodes



Transistor Outline Laser Diode Header
  • Laser diodes are getting hotter – and smaller and more complex. Laser diodes are very thermally sensitive, meaning if heat can be pulled out, they perform better and last longer.
  • Amulaire can make tiny, intricate copper transistor outline laser diode headers in mass volume, yielding products that dissipate heat more effectively and that can be manufactured cost-effectively.




Amulaire offers a wide range of technically advanced liquid-cooled and air-cooled thermal solutions.