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Amulaire Thermal Technology Will Exhibit a Number of Heat Dissipation Products at Spring 2006 Intel Developer Forum

Based on Advanced Metal Injection Molding Technology for Mixing Metals/Materials into Almost Any Shape

SAN FRANCISCO - INTEL DEVELOPER FORUM - March 7, 2006 - Amulaire Thermal Technology, a thermal management company, will exhibit a number of its heat dissipation products in Booth #308 at the Spring 2006 Intel Developer Forum (IDF), being held through March 9 at the Moscone Center West. Amulaire's heat dissipation products, aimed at desktop computer, laptop, industrial PC, IGBT (insulated gate bipolar transistor) and other high-performance semiconductor-based markets, include BTX heat sinks, heat spreaders and liquid-cooled cold plates. All are based on Amulaire's unique metal injection molding and other process technologies that allow the company to produce any shape in copper or mixed metals that can be produced in plastic.

"Today's semiconductor companies and makers of high-performance semiconductor-based products face increasingly challenging heat issues," said Ken Kaskoun, Amulaire's vice president, sales and marketing. "Amulaire offers process technologies for molding unique shapes in copper or any proportion of mixed metals and other materials, which can lead to better-performing thermal solutions that can be manufactured in volume and affordably, without machining. Our first-of-its-kind metal injection molding process gives customers unprecedented flexibility and control over the thermal management aspects of their design process."

One Amulaire product on exhibit at IDF of particular interest is a 130W BTX heat sink for the Intel Pentium 4 processor that incorporates both copper and aluminum fins in a copper base. The airfoil-shaped base enables maximum heat spreading and lower pressure drop. The BTX is ROHS (Restriction of Hazardous Substances) compliant due to complete solderless attachment.

Other Amulaire products on display include 84W and 95W BTX heat sinks; custom copper cold plates, used in liquid cooling systems for desktop computers; fan sinks for cooling graphics cards; custom heat sinks for use in laptops and industrial PCs; and heat spreaders, used in a wide range of high-powered semiconductor-based products.

About Amulaire
Amulaire Thermal Technology is addressing the most demanding thermal issues facing semiconductor companies, computer and telecom manufacturers, and makers of other high-performance semiconductor-based systems. Amulaire offers a unique combination of technical advances, design support and high-volume manufacturing processes that help customers squeeze time and cost from their thermal design process, achieve unprecedented design flexibility and gain greater control over factors such as thermal performance, size, shape and weight in their final products. Amulaire's unique manufacturing and assembly processes, including Advanced Molding Technology (AMT) and High Pressure Sintering (HPS), mean that Amulaire can create in metal (including copper), mixed metal and metal/non-metal materials combinations essentially any shape that can be created in plastic. With headquarters in San Diego, California, Amulaire also has a factory, design center and sales office in Taipei, Taiwan.